Original Article
  • Development of RVE Reconstruction Algorithm for SMC Multiscale Modeling
  • Hyoung Jun Lim*, Ho-Il Choi*, Sang Jae Yoon**, Sang Won Lim**, Chi Hoon Choi**, Gun Jin Yun***

  • * Depart. of Mechanical & Aerospace Engineering, Seoul National University, Seoul, Korea
    ** Hyundai Research & Development Center, Gyeonggi, Korea
    *** Depart. of Aerospace Engineering, Seoul National University, Seoul, Korea

  • SMC 복합재료 멀티스케일 모델링을 위한 RVE 재구성 알고리즘 개발
  • 임형준*· 최호일*· 윤상재**· 임상원**· 최치훈**· 윤군진***†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.


This paper presents a novel algorithm to reconstruct meso-scale representative volume elements (RVE), referring to experimentally observed features of Sheet Molding Compound (SMC) composites. Predicting anisotropic mechanical properties of SMC composites is challenging in the multiscale virtual test using finite element (FE) models. To this end, an SMC RVE modeler consisting of a series of image processing techniques, the novel reconstruction algorithm, and a FE mesh generator for the SMC composites are developed. First, micro-CT image processing is conducted to estimate probabilistic distributions of two critical features, such as fiber chip orientation and distribution that are highly related to mechanical performance. Second, a reconstruction algorithm for 3D fiber chip packing is developed in consideration of the overlapping effect between fiber chips. Third, the macro-scale behavior of the SMC is predicted by the multiscale analysis

본 논문은 단섬유 칩으로 구성된 Sheet Molding Compound(SMC) 복합재료를 실험적으로 관찰된 특징들을 바탕으로 메소스케일(meso-scale) 대표체적요소(RVE: Representative Volume Element)를 재구성하는 새로운 알고리즘을 제시한다. 전산해석을 이용하여 SMC 복합재료의 비등방성 거동의 정확한 예측은 어려운 문제이다. 이를 극복하기 위해, SMC 복합재료를 위한 일련의 이미지 프로세싱 기술과 재구성 알고리즘 및 유한요소(FE: Finite Element) 생성기로 구성된 SMC RVE 모델을 개발하였다. 첫째, micro-CT 이미지 프로세싱은 SMC 물성에 직접적인 상관관계를 가지는 섬유칩의 배향 및 분산의 확률적 분포를 평가한다. 둘째, 해당 통계적 분포를 바탕으로 섬유칩 간의 겹침효과를 고려한 섬유칩 팩킹 재구성 알고리즘을 개발한다. 마지막으로, SMC 복합재료 멀티스케일 해석을 이용하여 매크로스케일(macro-scale)에서의 거동을 파악하고 실험데이터를 통해 검증을 수행한다

Keywords: 멀티스케일 해석(Multiscale analysis), 복합재료(Composite materials), SMC(Sheet Molding Compound), 재구성 알고리즘(Reconstruction algorithm)

This Article

Correspondence to

  • Gun Jin Yun
  • Depart. of Aerospace Engineering, Seoul National University, Seoul, Korea

  • E-mail: gunjin.yun@snu.ac.kr