Original Article
  • Manipulating Anisotropic Filler Structure in Polymer Composite for Heat Dissipating Materials: A Mini Review
  • Seong-Bae Min*, Chae Bin Kim*,**†

  • * School of Chemical Engineering, Pusan National University, Busan 46241, Korea
    ** Department of Polymer Science and Engineering, Pusan National University, Busan 46241, Korea

  • 방열소재로의 응용을 위한 고분자 복합소재 내 이방성 필러 구조 제어 연구동향
  • 민성배* · 김채빈*,**†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Efficient heat dissipation in current electronics is crucial to ensure the best performance and lifespan of the devices along with the users’ safety. Materials with high thermal conductivity are often used to dissipate the generated heat from the electronics to the surroundings. For this purpose, polymer composites have been attracted much attention as they possess advantages rooted from both polymer matrix and thermally conductive filler. In order to meet the thermal conductivity required by relevant industries, composites with high filler loadings (i.e., >60 vol%) have been fabricated. At such high filler loadings, however, composites lose benefits originated from the polymer matrix. To achieve high thermal conductivity at a relatively low filler loading, therefore, constructing the heat conduction pathway by controlling filler structure within the composites may represent a judicious strategy. To this end, this review introduces several recent approaches to manufacturing heat dissipating materials with high thermal conductivity by manipulating thermally conductive filler structures in polymer composites


전자 기기의 발달에 따라 발생하는 발열 문제를 해결하기 위해 높은 열전도도를 갖는 방열소재의 개발이 필요하다. 고분자 복합소재는 고분자의 장점과 열전도성 필러의 장점을 동시에 지녀 경량 방열소재로 각광받고 있다. 하지만, 산업적으로 요구되는 열전도도를 달성하기 위해서는 볼륨비로 60 이상의 고함량의 필러 충진이 요구되므로 최근에는 필러의 구조 제어를 통해 비교적 저함량의 필러 충진으로도 열 전달 경로를 최적화할 수 있는 연구들이 진행되고 있다. 본 리뷰에서는 고분자 복합소재 내 열전도성 이방성 필러의 구조를 제어해 비교적 적은 필러 함량으로 고열전도성 방열소재를 제작하는 다양한 전략을 소개하고자 한다


Keywords: 열계면재료(Thermal interface material), 방열소재(Heat dissipating material), 이방성 필러(Anisotropic filler), 고분자 복합소재(Polymer composite), 열전도도(Thermal conductivity), 필러 배향(Filler alignment), 3차원 네트워크 구조(3D network structure)

This Article

Correspondence to

  • Chae Bin Kim
  • * School of Chemical Engineering, Pusan National University, Busan 46241, Korea
    ** Department of Polymer Science and Engineering, Pusan National University, Busan 46241, Korea

  • E-mail: cbkim@pusan.ac.kr