Original Article
  • Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package
  • Seong Yeon Park*, Seung Yoon On*, Seong Su Kim*

  • * Department of Mechanical Engineering, KAIST

  • 초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발
  • 박성연*· 온승윤*· 김성수*†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

  • 1. Lu, D., and Wong, C.P. (Eds.), “Materials for Advanced Packaging”, Vol. 181, New York: Springer, 2009.
  • 2. Li, Y., and Goyal, D. (Eds.), “3D Microelectronic Packaging: from Fundamentals to Applications”, Vol. 57, Springer, 2017.
  • 3. Centea, T., and Nutt, S.R., “Manufacturing Cost Relationships for Vacuum Bag-only Prepreg Processing”, Journal of Composite Materials, Vol. 50, No. 17, 2016, pp. 2305-2321.
  • 4. Witik, R.A., Gaille, F., Teuscher, R., Ringwald, H., Michaud, V., and Månson, J.-A.E., “Economic and Environmental Assessment of Alternative Production Methods for Composite Aircraft Components”, Journal of Cleaner Production, Vol. 29, 2012, pp. 91-102.
  • 5. Monaghan, P.F., and Brogan, M.T., “An Overview of Heat Transfer for Processing Thermoplastic Composites in Autoclaves”, Proc Flow Processes in Composites Materials Conference. 1991.
  • 6. Chien, A.T., Cho, S., Joshi, Y., and Kumar, S., “Electrical Conductivity and Joule heating of Polyacrylonitrile/Carbon Nanotube Composite Fibers”, Polymer, Vol. 55, No. 26, 2014, pp. 6896-6905.
  • 7. Mohiuddin, M., and Hoa, S.V., “Temperature Dependent Electrical Conductivity of CNT–PEEK Composites”, Composites Science and Technology, Vol. 72, No. 1, 2011, pp. 21-27.
  • 8. Lee, J., Ni, X., Daso, F., Xiao, X., King, D., Gómez, J.S., Varela, T.B., Kessler, S.S., and Wardle, B.L., “Advanced Carbon Fiber Composite Out-of-autoclave Laminate Manufacture via Nanostructured Out-of-oven Conductive Curing”, Composites Science and Technology, Vol. 166, 2018, pp. 150-159.
  • 9. Tsai, M.Y., Ting, C.W., Huang, C.Y., and Lai, Y.S., “Determination of Residual Strains of the EMC in PBGA during Manufacturing and IR Solder Reflow Processes”, Microelectronics Reliability, Vol. 51, No. 3, 2011, pp. 642-648.

This Article

Correspondence to

  • Seong Su Kim
  • Department of Mechanical Engineering, KAIST

  • E-mail: seongsukim@kaist.ac.kr