Original Article
  • The Method for Strengthening of Interfacial Adhesion of Overmolded Materials via Injection-Compression Molding

  • Donguk Kim*, Yoon-Bo Shim*, Young-Bin Park*†

  • * Department of Mechanical Engineering, Ulsan National Institute of Science and Technology (UNIST)

  • 사출압축 공정을 활용한 오버몰딩 소재간 계면 접합력 강화

  • 김동욱* · 심윤보* · 박영빈*†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

References
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  • 7. Kwon, Y. I., Lim, E., and Song, Y. S., “Simulation of injection-compression molding for thin and large battery housing,” Current Applied Physics, Vol. 18, No. 11, 2018, pp. 1451-1457.
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  • 8. Masato, D., Sorgato, M., and Lucchetta, G., “Characterization of the micro injection-compression molding process for the replication of high aspect ratio micro-structured surfaces,” Microsystem Technologies, Vol. 23, 2017, pp. 3661-3670.
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This Article

Correspondence to

  • Young-Bin Park

  • Department of Mechanical Engineering, Ulsan National Institute of Science and Technology (UNIST)

  • E-mail: ypark@unist.ac.kr