Original Article
  • Prediction of the Warpage for Large-scale Semiconductor Package Using Equivalent Model Considering the Anisotropic Thermomechanical Properties Based on Multi-physics Simulation

  • Woong-Kyoo Yoo*, Jeong-Hyeon Baek*, Jong-Whi Park*, Hak-Sung Kim*,**†

  • * Department of Mechanical Convergence Engineering, Hanyang University, Seoul, Republic of Korea
    ** Hanyang Research Center for Advanced Semiconductor Packaging, Hanyang University

  • 다중 물리 시뮬레이션 기반 이방성 열-기계적 특성을 고려한 등가 모델링 활용 대면적 반도체 패키지의 워피지 예측

  • 유웅규* · 백정현* · 박종휘* · 김학성*,**†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

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This Article

Correspondence to

  • Hak-Sung Kim

  • * Department of Mechanical Convergence Engineering, Hanyang University, Seoul, Republic of Korea
    ** Hanyang Research Center for Advanced Semiconductor Packaging, Hanyang University

  • E-mail: kima@hanyang.ac.kr