Gyu-Won Kim*, Hyun-Ji Rho*, Young-Woo Kim*, Jun-Seop Song*, Woe Tae Kim*, Dong-Hwi Kim**, Hak-Sung Kim*, ***†
* Department of Mechanical Convergence Engineering, Hanyang University, Seoul, Republic of Korea
** AVP Division, Hyundai Motor Group, Uiwang-si, Gyeonggi-do, Republic of Korea
*** Center for Advanced Semiconductor Packaging, Hanyang University, Seoul, Republic of Korea
김규원* · 노현지* · 김영우* · 송준섭* · 김외태** · 김동휘** · 김학성*, ***†
This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
This Article2026; 39(3): 248-252
Published on Jun 30, 2026
Correspondence to* Department of Mechanical Convergence Engineering, Hanyang University, Seoul, Republic of Korea
*** Center for Advanced Semiconductor Packaging, Hanyang University, Seoul, Republic of Korea